| 摘要 |
PROBLEM TO BE SOLVED: To provide a stable molded package structure for the dynamic quantity sensor wherein a lid part made of a resin which is laminated to one surface side of a substrate having a movable part on the one surface side is molded with resin, and flow of a molding material is controlled while maintaining strength of the lid part when molding. SOLUTION: A dynamic quantity sensor S1 comprises a substrate 10 which has a movable part 11 for detecting the dynamic quantity on one surface side, and a lid part 20 laminated to the one surface side off the substrate 10, which is molded with the resin 40 so that the substrate 10 and the lid part 20 may be enclosed. The lid part 20 are separated from the movable part 11. The external surface corresponding to the movable part 11 is adapted to be a convex curve part 21 which is externally convex among the lid part 20. COPYRIGHT: (C)2003,JPO
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