| 摘要 |
Process for soldering aluminum comprises carrying out a reducing plasma treatment of the aluminum surface, and soldering. An Independent claim is also included for a device for carrying out the above process comprising a process chamber for the plasma treatment connected to a soldering unit. Preferred Features: A plasma based on noble gases, nitrogen, hydrogen, alkyl-forming gases, fluorides and their mixtures and/or compounds is used as the process gas. The plasma treatment is carried out at a pressure of less than 2 x 104 Pa, preferably less than 104 Pa, especially less than 200 Pa.
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