发明名称 HIGH THERMAL CONDUCTIVITY COMPOSITION AND MOLDED PRODUCT THEREFROM
摘要 PROBLEM TO BE SOLVED: To obtain a composition with excellent moldability and mass productivity specific to plastic materials, exhibiting thermal conductivity high enough to be substituted for conventional metallic parts or inorganic material parts and further having decreased shrinkage at curing and also to provide a molded product using the same. SOLUTION: The high thermal conductivity composition includes (A) an unsaturated polyester whose softening point is in the range of 90-150°C, (B) a diallyl phthalate which is a monomer copolymerizable with the unsaturated polyester, (C) a thermoplastic resin, (D) an alumina filler and (E) an organic peroxide as essential components. The content ratios of the components (A) and (B) are respectively 35-80 wt.% and 5-25 wt.% based on the sum of the components (A), (B) and (C). The content ratio of the component (D) is 60-90 wt.% based on the entire composition. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003253086(A) 申请公布日期 2003.09.10
申请号 JP20020053124 申请日期 2002.02.28
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 MATSUI FUMIO;HATANO YOSHITAKA;TAKAHASHI KENTARO
分类号 C08J5/00;C08F283/01;C08K3/22;C08L55/00;C08L101/00;(IPC1-7):C08L55/00 主分类号 C08J5/00
代理机构 代理人
主权项
地址