PROCESS AND APPARATUS FOR DISENGAGING SEMICONDUCTOR DIE FROM AN ADHESIVE FILM

摘要

An apparatus and method for separating a semiconductor die ( 303 ) from an adhesive tape ( 32 ) are disclosed. The apparatus includes a blade ( 34 ) mechanically coupled to a blade holder ( 36 ), wherein the blade ( 34 ) is inclined relative to the primary surface of the semiconductor die ( 303 ). The method further comprises lifting the semiconductor die ( 303 ) while it is attached to the adhesive tape ( 32 ) to assist disengagement. The blade ( 34 ) facilitates peeling of the semiconductor die ( 303 ) from the adhesive tape ( 32 ) while distributing stress exerted on the semiconductor die ( 303 ) over a larger surface area resulting in reduced die fractures ( 20 ).