| 发明名称 |
Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
| 摘要 |
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path.
|
| 申请公布号 |
US6616801(B1) |
申请公布日期 |
2003.09.09 |
| 申请号 |
US20000541109 |
申请日期 |
2000.03.31 |
| 申请人 |
LAM RESEARCH CORPORATION |
发明人 |
BOYD JOHN M. |
| 分类号 |
B24B57/04;B24B21/00;B24B21/18;B24B37/04;B24D3/28;B24D11/00;B24D18/00;H01L21/304;(IPC1-7):H01L2/302;C23F1/00 |
主分类号 |
B24B57/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
