| 摘要 |
PROBLEM TO BE SOLVED: To effectively hold the transmission efficiency of a high-frequency signal transmitted from an input/output terminal, and to improve reliability of airtightness in a package for storing a semiconductor element. SOLUTION: The package is provided with a plate part 1 consisting of an approximately rectangular dielectric plate formed by laminating a plurality of dielectric layers and having a line conductor 3 formed from one side of the upper surface of the dielectric plate to the other opposed side and an erected wall part 4 consisting of a dielectric substance joined with the upper surface of the plate part 1 over the line conductor 3. An inner conductor layer 1a is formed in the plate part 1 so as to be opposed at least to the line conductor 3, a lower grounding conductor 2 is formed over almost the whole lower surface of the plate part 1, a notch part 11a notched between upper and lower main surfaces is formed on the end of the dielectric layer 11, on the lower side of the inner conductor layer 1a directly under the end part of the line conductor 3 and a conductor layer 11b for electrically connecting the inner conductor layer 1a to the lower grounding conductor 2 is formed in the notch part 11a. COPYRIGHT: (C)2003,JPO
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