METHOD OF MANUFACTURING HEAVY CURRENT CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To control generation of voids for manufacturing a heavy current circuit substrate where a thick conductor pattern is allocated. SOLUTION: The thick conductor pattern 3 of the predetermined shape of circuit and an insulated substrate 2 of the shape corresponding to a cavity of the relevant thick conductor pattern 3 are prepared. A prepreg 4 is laminated to both sides or single side of the thick conductor pattern body where the insulated substrate 2 is engaged with the cavity thereof and these are integrated with the heated and pressurized molding to form the heavy current circuit substrate. During the heated and pressurized molding process, the insulated substrate 2 does not flow and sufficient molding pressure is applied to the prepreg 4 like the other places in the cavity area of the thick conductor pattern 3 because the insulated substrate 2 becomes a backup material. Accordingly, generation of voids can be prevented. Thickness of the insulated substrate 2 is preferably within the thickness thinner by 300μm from the thickness of the thick conductor pattern 3 and the thickness thicker by 300μm from the thickness thereof. COPYRIGHT: (C)2003,JPO