| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, RESIST PATTERN FORMING METHOD AND METHOD FOR PRODUCING PRINTED WIRING BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high tent strength and excellent in adhesion to a substrate for forming a circuit. <P>SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond per molecule and (C) a photopolymerization initiator, wherein a compound having one cycloalkylene group, one or more polyoxyalkylene (2-6C) skeletons and two (meth)acryloyl groups composes the component (B). <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003248306(A) |
申请公布日期 |
2003.09.05 |
| 申请号 |
JP20020050118 |
申请日期 |
2002.02.26 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
NATORI MICHIKO;HIDAKA TAKAHIRO;KOBAYASHI AKIHIRO;HAYASHI KATSUNORI |
| 分类号 |
G03F7/027;C08F2/44;C08F290/06;C08F291/00;G03F7/004;G03F7/029;G03F7/031;G03F7/033;G03F7/40;H05K3/06;H05K3/18 |
主分类号 |
G03F7/027 |
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