发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same, which suppresses leakage current due to impurities variation that tends to occur in a high-resistance semiconductor substrate employed therein for raising the Q-value of a passive circuit element, and improves noise immunity of active elements on the high-resistance semiconductor substrate. SOLUTION: The semiconductor device comprises bipolar transistors 32, 33 formed on the principal surface of the semiconductor substrate 1. The bipolar transistors comprise first conductivity semiconductor layers 3a, 3b at the bottom thereof. The semiconductor device is provided with a second conductivity embedded layer 2, which is disposed inside the semiconductor substrate 1 so as to face the first conductivity semiconductor layers 3a, 3b. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249503(A) 申请公布日期 2003.09.05
申请号 JP20020049750 申请日期 2002.02.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 FURUKAWA TAISUKE;YONEDA KIWA;IKEDA TATSUHIKO
分类号 H01L21/331;H01L21/8249;H01L27/06;H01L29/732;H01L29/737;(IPC1-7):H01L21/331 主分类号 H01L21/331
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