发明名称 Method of forming a ferroelectric film and fabrication process of a semiconductor device having a ferroelectric film
摘要 A method of forming a ferroelectric film includes the steps of forming a layer by a material that takes a metal state in a reducing ambient and an oxide state in an oxidizing ambient, and depositing a ferroelectric film on a surface of the layer by supplying gaseous sources of the ferroelectric film and an oxidizing gas and causing a decomposition of the gaseous sources at the surface of said layer, wherein the step of depositing the ferroelectric film is started with a preparation step in which the state of the surface of said layer is controlled substantially to a critical point in which the layer changes from the metal state to the oxide state and from the oxide state to the metal state.
申请公布号 US2003166304(A1) 申请公布日期 2003.09.04
申请号 US20030338647 申请日期 2003.01.09
申请人 FUJITSU LIMITED 发明人 YAMAWAKI HIDEKI
分类号 C23C16/40;H01L21/02;H01L21/31;H01L21/314;H01L21/316;H01L21/8246;H01L27/105;(IPC1-7):H01L21/00;H01L21/824 主分类号 C23C16/40
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