发明名称 Integrated circuits having and adjacent p-type doped regions having shallow trench isolation structures without liner layers therein therebetween and methods of forming same
摘要 An integrated circuit substrate includes first and second adjacent p-type doped regions spaced-apart from one another. A trench in the integrated circuit substrate is between the first and second adjacent p-type doped regions. An insulator layer in the trench has a side wall, wherein the side wall is free of a layer that reduces a stress between the integrated circuit substrate and the insulator layer. <IMAGE>
申请公布号 EP1213757(A3) 申请公布日期 2003.09.03
申请号 EP20010128854 申请日期 2001.12.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH, YONG-CHUL;JIN, GYO-YOUNG
分类号 H01L21/76;H01L21/762;H01L21/8234;H01L21/8242;H01L27/08;H01L27/10;H01L27/108 主分类号 H01L21/76
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