发明名称 Heat dissipator for integrated circuits
摘要 <p>Heat dissipator for integrated circuits (2) comprising a dispersion element (3) able to be associated to an integrated circuit (2), through securing means (4) constituted by two locking elements (9) mounted on the dispersion element (3) in mutually opposite positions. The locking elements (9) have each a latching pin (11) and are able to slide laterally to the dispersion element (3) from a lower position in which the pins (11) are inferiorly distanced from the base (5) and form between them a passage (12) for the coupling of the dissipator (1) on an integrated circuit (2), to an upper position in which the pins (11) are proximate to the base (5) and are mutually approached. The dissipator (1) further comprises elastic means (13) interposed between the dispersion element (3) and the locking elements (9) to thrust them towards the upper position. <IMAGE></p>
申请公布号 EP1341230(A1) 申请公布日期 2003.09.03
申请号 EP20020425108 申请日期 2002.02.27
申请人 SPARK ELECTRONIC S.R.L. 发明人 SEGALA, MARCO
分类号 H01L23/40;(IPC1-7):H01L23/40 主分类号 H01L23/40
代理机构 代理人
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