| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device which can compensate for an orthogonal error and a resolution error of a head table and a camera table. SOLUTION: The method of manufacturing semiconductor device comprises a process to determine parameters to calculate the amount of compensation of position to determine the relative position of the position of a semiconductor chip using the imaging result of a wiring substrate with a second imaging system when positioning the chip held by a bonding head and a wiring substrate placed on a bonding stage, respectively, by teaching an error of crossing angle of the X, Y axes of the camera table where a first imaging system and the second imaging system are integrated, an error of crossing angle of the X, Y axes of the head table to operate the bonding head, relative errors of magnifications of the camera table and head table, camera offsets at the first and second imaging systems, and an error of rotation center of theΘaxis to rotate the bonding head provided in the head table around the Z axis thereof. COPYRIGHT: (C)2003,JPO
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