| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency circuit that maintains high-frequency separation among at least two circuits and at the same time shares one via hole, and to further miniaturize MICs and MMICs. SOLUTION: In a high-frequency grounded circuit having at least two leading metal wires that are connected to a land section around a via hole, the leading wires are arranged so that a segment for connecting the land section to the connection point of the leading wires is cut off by the via hole. COPYRIGHT: (C)2003,JPO
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