| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor manufacturing device to acquire interior temperature data of a furnace in an evacuated state and, at the same time, to prevent an occurrence of breakage when a thermocouple is inserted and removed. SOLUTION: The semiconductor manufacturing device is provided with a furnace temperature measuring instrument. The furnace temperature measuring instrument is provided with a protecting tube 32 airtightly inserted into the furnace, an insertion preventing section 32a which is provided on the exposed part of the tube 32, and a thermocouple 31 housed in the tube 32. COPYRIGHT: (C)2003,JPO
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