发明名称 Semiconductor processing apparatus and wafer sensor module
摘要 A semiconductor processing apparatus for processing a semiconductor in a processing chamber separated from the air wherein the processing chamber contains a wafer stage on which there is positioned a wafer sensor module equipped with sensor probes, each sensor probe capable of detecting at least one of electric current, voltage and temperature of an article to be processed and placed on the wafer sensor module, which is carried into the processing chamber by a transporting means for the article to be processed, and detected values by the sensor probes being converted to optical signals and led to outside of the processing chamber, can optimize conditions for processing the article easily and in a short time without lowering throughput.
申请公布号 US2003160628(A1) 申请公布日期 2003.08.28
申请号 US20020083255 申请日期 2002.02.27
申请人 UDO RYUJIRO;ARAI MASATSUGU;EDAMURA MANABU 发明人 UDO RYUJIRO;ARAI MASATSUGU;EDAMURA MANABU
分类号 G01R31/28;(IPC1-7):G01R31/26 主分类号 G01R31/28
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