CIRCUIT MODULE AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a circuit module (1) comprising a plurality of electronic components (2) and a method for the production thereof. Said circuit module (1) comprises a circuit carrier (3) which is ceramic and a housing made of synthetic material (4). The differences in thermal expansion coefficients are minimised in such a way that the circuit carrier (3) is separated with electronic components (2) into a plurality of circuit carrier sections (5) The partitioning lines are electrically bridged by corresponding bond connections (6) in the synthetic material housing (4).