| 摘要 |
PROBLEM TO BE SOLVED: To form a plating film only on the surface of an electrode without allowing the plating film to be formed on a ceramic body, by which the improvement in the yield of products is made possible without the occurrence of appearance defects and the occurrence of migration is prevented without entailing the degradation in electric current efficiency. SOLUTION: The semiconductor ceramics (ceramic body) formed with the electrode on its surface is subjected, as the object to be plated, to electroplating by forming a barrel into which a cathode rod and the object to be plated are contained as a cathode 8 and an anode 7 consisting of plating metal and impressing a potential between the anode 7 and the cathode 8 while controlling the potential to be impressed by a potentiostat 9 in such a manner that the potential to be impressed on the electrode is electrochemically baser than the equilibrium potential of the plating metal and that the potential impressed on the semiconductor ceramics is electrochemically nobler than the equilibrium potential of the plating metal. COPYRIGHT: (C)2003,JPO
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