发明名称 |
Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
摘要 |
A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an insulative isolating layer on the pad-mounting surface, and forming a conductive body in the insulative isolating layer. The isolating layer has a contact receiving cavity, and an access hole for access to the contact receiving cavity. The access hole is narrower than the contact receiving cavity. The conductive body has an anchor portion filling the contact receiving cavity and the access hole and connecting electrically with the bonding pad. |
申请公布号 |
US6610558(B2) |
申请公布日期 |
2003.08.26 |
申请号 |
US20020125179 |
申请日期 |
2002.04.17 |
申请人 |
COMPUTECH INTERNATIONAL VENTURES LIMITED |
发明人 |
CHEN I-MING |
分类号 |
H01L23/12;H01L21/60;H01L23/485;H01L23/528;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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