| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for measuring the shape of a transparent film capable of precisely measuring the shape of a transparent film with a low reflection coefficient formed on a silicon wafer. SOLUTION: In measuring the shape of the transparent film on the silicon wafer, the shape is measured by irradiating the light whose wavelength is 1.1μm-15μm to the transparent film and imaging the reflected light from the transparent film by a light detector. At the time, the light with the wavelength of 1.1μm-15μm irradiated on the transparent film is the parallel light in the linear fringe pattern parallel in one direction. The device for measuring the shape of the transparent film comprises a means for imaging the reflected fringe pattern including the information corresponding to the shape of the transparent film and an analysis means for finding the measured shape of the transparent film based on the image information provided by the imaging means. COPYRIGHT: (C)2003,JPO
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