| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor suitable for large current. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 2, a lead frame 1 for supporting the semiconductor chip, and conductive foil 3 for connecting the semiconductor chip with the lead frame. A conductive adhesive 4 is used for connecting the semiconductor chip and the conductive foil, and the conductive adhesive 4 is surrounded by an insulating adhesive 8 which has adhesive strength higher than that of the conductive adhesive. <P>COPYRIGHT: (C)2003,JPO |
