发明名称 HIGH DENSITY 3-D INTEGRATED CIRCUIT PACKAGE
摘要 <p>A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.</p>
申请公布号 WO2003069969(P1) 申请公布日期 2003.08.21
申请号 US2003001910 申请日期 2003.01.22
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