Multiwire saw for cutting single crystal into thin semiconductor wafers, includes several wire-guiding rolls wound by saw wire and bearing made of silicon carbide to rotatably support wire-guiding roll

摘要

A saw wire (1) is wound several times around the wire-guiding rolls (3), in which two adjacent wire-guiding rolls combine to form a saw gate. A ceramic sliding-contact bearing (15) made of silicon carbide, rotatably supports each wire- guiding roll. An Independent claim is also included for method of cutting single crystal into thin semiconductor wafer.