发明名称 |
Detergent composition |
摘要 |
To provide a detergent composition which has little corrosion to a wiring material and is excellent in cleaning ability of a semiconductor substrate or semiconductor device on which the fine particles and the metal impurities are deposited. A detergent composition comprising a reducing agent, wherein the detergent composition has an oxidation-reduction potential at 25° C. of +0.2 V or less, and a pH at 25° C. of from 3 to 12; and a cleaning process of a semiconductor substrate or a semiconductor device using the detergent composition.
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申请公布号 |
US2003158059(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020311471 |
申请日期 |
2002.12.16 |
申请人 |
SAKAI AKIMITSU;TAMURA ATSUSHI |
发明人 |
SAKAI AKIMITSU;TAMURA ATSUSHI |
分类号 |
C11D3/00;C11D7/02;C11D7/26;C11D7/34;C11D11/00;C23G1/20;H01L21/306;(IPC1-7):C11D1/00 |
主分类号 |
C11D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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