发明名称 |
ANIONIC ABRASIVE PARTICLES TREATED WITH POSITIVELY-CHARGED POLYELECTROLYTES FOR CMP |
摘要 |
The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged polyelectrolyte.
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申请公布号 |
WO03068883(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
WO2003US03930 |
申请日期 |
2003.02.10 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
CHERIAN, ISAAC, K.;CARTER, PHILLIP, W.;CHAMBERLAIN, JEFFREY, P.;MOEGGENBORG, KEVIN, J.;BOLDRIDGE, DAVID, W. |
分类号 |
B24B37/04;C09G1/02;C09K3/14;H01L21/304;(IPC1-7):C09G1/16 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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