| 摘要 |
<p>In a high frequency unit according to the present invention, since outflow preventive means (11) for preventing an adhesive agent from flowing out is disposed on a circuit substrate (1) so as to surround the circumference of an IC component (4), an adhesive agent (8) is filled in a spacing between the IC component (4) and the outflow preventive means (11), and the IC component (4) is thus bonded to the circuit substrate (1) by the adhesive agent (8), the outflow preventive means (11) prevents the adhesive agent (8) from flowing out towards solder (7), whereby the high frequency unit achieves high reliability and is also free from short circuiting between the solder and an adjacent land, occurrence of a solder ball, and short circuiting between adjacent conductive patterns. <IMAGE></p> |
