| 摘要 |
Disclosed is an electronic micro component (1) made on the basis of a semi-conducting substrate (2), comprising a capacitive structure which is applied on top of a main plane (7) of the substrate. The capacitive structure is provided with two electrodes (20,33), each of which comprises a flat portion (11, 38) running parallel to the main plane (7) of the substrate and a plurality of walls (16-18,34-37) that run parallel to each other and perpendicular to the flat portion (11, 38), to which said walls are connected. The parallel walls of each electrode are arranged one (16-18) between the other (34-37). |
