| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a lid material for forming a lid which is a sealing means for a hollow package for an electronic part, at relatively low cost while a high sealing function is maintained. SOLUTION: This method is for manufacturing the lid material used for the lid that is welded to the peripheral part of the upper part of the package, containing a recess, that has an upper surface housing an electronic part of ceramics or metal as an opening, to seal the opening. An electrolytic plating layer of Au and an electrolytic plating layer of Sn are alternately laminated as sealing materials on the surface of a ribbon metal core material, to form a plating layer in which a bottom layer and a top layer are the Au electrolytic plating layers. Then heat treatment is performed, and the plated Au and Sn are made eutectic. Then the plating layer is punched out into a required size by press working to form the lid. Or, after the electrolytic plating layer of an alloy of Au and Sn is formed on the surface of the ribbon metal core material as the sealing material, these are punched out into the required size by press working, to make the lid. COPYRIGHT: (C)2003,JPO
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