| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein device area can be reduced and its manufacturing method. SOLUTION: The semiconductor device is provided with a wiring 27 having a hole 29, a storage element 30 arranged on the wiring 27, and connection members 34, 26 which are connected with the storage element 30 and penetrate the hole 29 being isolated from the wiring 27. COPYRIGHT: (C)2003,JPO |
