THERMOSETTING RESIN COMPOSITION, ADHESIVE FILM, COPPER- CLAD LAMINATE AND PRINTED-CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition as an adhesive having high heat resistance sufficiently resistant to lead free soldering for providing a highly heat resistant copper-clad laminate and a printed-circuit board and provide an adhesive film using the same. SOLUTION: This thermosetting resin composition has 3-20% tensile elongation and 0.05-7% coefficient of thermal expansion at 50-300°C after thermosetting the composition. This adhesive film is prepared by forming a layer of the resin composition at least on one side of a support base or an adherent body in the state of B stage. This copper-clad laminate and this printed-circuit board include the adhesive film or the resin composition. COPYRIGHT: (C)2003,JPO