| 摘要 |
PROBLEM TO BE SOLVED: To improve workability in assembling by assuring heat dissipation for a heating electronic component such as, for example, a power transistor or the like. SOLUTION: The control unit has a case 1 having a heat dissipation stepped part 2 in which a heat sink 8B of the power transistor 8 is brought into surface contact with one side of a lengthwise direction and a board pedestal 3 is provided at the other side. The control unit comprises a brace 10 disposed in a temporarily fastened state together with the transistor 8 on a board 4 to hold the sink 8B of the transistor 8 between the brace 10 and the part 2 of the case 1. The board 4 an the brace 10 are clamped together with the pedestal 3 with a cover 13 by using a plurality of clamping screws 14, and the sink 8B of the transistor 8 is fixed in a state held between the part 2 and the brace 10. COPYRIGHT: (C)2003,JPO |
