发明名称 METHOD FOR PRODUCING SEMICONDUCTOR WAFER, METHOD AND SYSTEM FOR RECEIVING PRODUCTION ORDER OF SEMICONDUCTOR WAFER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for producing a semiconductor wafer, and method and system for receiving production order of wafer in which wafers are supplied in accordance with the device fabrication process of a device manufacturer. <P>SOLUTION: The method for producing a semiconductor wafer comprises a step for acquiring device fabrication process information, a step for selecting a corresponding wafer production process, and a step for producing a wafer by a selected production process. The method for receiving production order of semiconductor wafer comprises a step for connecting the client computers of a device manufacturer and a wafer manufacturer, a step for receiving device fabrication process information through the client computer, and a step for selecting a corresponding wafer production process. The system for receiving production order of wafer comprises a client terminal of a device manufacturer and a client computer of a wafer manufacturer wherein the client terminal receives device fabrication process information and transmits it, and the client computer receives the device fabrication process information and selects a corresponding wafer production process. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003224045(A) 申请公布日期 2003.08.08
申请号 JP20020019334 申请日期 2002.01.29
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 ITO TATSUO;NEZU SHIGEYOSHI;ICHIKAWA MASASHI;OHARA NOBUHIRO
分类号 G05B19/418;G06Q10/00;G06Q50/00;G06Q50/04;H01L21/02;(IPC1-7):H01L21/02;G06F17/60 主分类号 G05B19/418
代理机构 代理人
主权项
地址