| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding apparatus for introducing automation for mounting electronic components to a stem. SOLUTION: In this die bonding apparatus 1, after a stem 2 is mounted on a stem mounting head 6, when an electronic component S is placed on a component mounting surface 27 of the stem 6 and when a stem base 24 is heated by a heater 9, the stem 2 must be surely mounted on the step mounting head 6 without any displacement. Therefore, the stem 2 can be easily and surely fixed and maintained to the stem mounting head 6 by providing a chuck 40 to the stem mounting head 6 and then holding the circumference 24a of the stem base 24 by a plurality of clams 47 provided at the end of an oscillating lever 41 of the chuck 40. Moreover, the structure of the chuck 40 is employed corresponding to various shapes of the stem base 24 and can be used for the centering of the stem base 24. COPYRIGHT: (C)2003,JPO
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