发明名称 ENCAPSULATION OF ORGANIC ELECTRONIC DEVICES USING ADSORBENT LOADED ADHESIVES
摘要 <p>Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.</p>
申请公布号 WO2003065470(P1) 申请公布日期 2003.08.07
申请号 US2002038144 申请日期 2002.11.26
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