| 摘要 |
Seed holes (h) are formed by discharging a pressure medium (G) in a resin body (R) injected in a cavity (4) of a die (MS1). By expanding the cavity (4), supplying the pressure medium (G) to the seed holes (h), a size of the resin body (R) is increased, making the seed holes grow, to have a molded resin plate (Vr1) made of the resin body increased in the size and formed with the seed holes grown to internal voids (Vd).
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