| 摘要 |
The device for holding wafers by suction means comprises a support face (3) which is rigid and flat, a set of bumps carried by the support face, and the suction means opening up at the support face. The set of bumps (14) is formed by a porous screen (8) made of crossed wires (10,11) on the support face (3), and in particular the screen is of the type as used in serigraphy. The screen (8) is stretched on the support face (3) and fastened along its periphery. The suction means comprise a set of openings located on the support face, or one central opening of a duct connected to a vacuum system. In the second embodiment, the set of bumps is formed by the profile of the support face and laid out so that the global planarity is retained. Each of the surface bumps is in the form of a rounded projection. The device constitutes an autonomous tool for manipulating the wafers, or a removable part of a machine for the processing of wafers.
|
