发明名称 HIGH-PRECISION LAMINATED ELECTRONIC COMPONENT SUPPORT DEVICE
摘要 A high-precision laminated electronic component support device, comprising a plate-like component supporting elastic member (110e) having a large number of component support holes for supportedly inserting electronic components (200) disposed therein arranged in longitudinal and lateral directions and passed through in vertical direction, a metal support plate (120e) having a large number of opening holes corresponding to the component support holes of the component supporting elastic member formed therein and detachably overlapped with at least one of the upper and lower surfaces of the component supporting elastic member, and a reinforcement plate (130e) for maintaining the overlapped state of the component supporting elastic member with the metal support plate, whereby the high-precision laminated electronic component support device can be easily manufactured at a low cost by overlapping one or a plurality of metal support plates on at least one of the upper and lower surfaces of the plate-like component supporting elastic member having the large number of component support holes for supportedly inserting the electronic components disposed therein and maintaining the overlapped state of the component supporting elastic member with the metal support plate by the reinforcement plate.
申请公布号 WO03063571(A1) 申请公布日期 2003.07.31
申请号 WO2003JP00404 申请日期 2003.01.20
申请人 HIRUTA CO., LTD.;HIRUTA, KENGO 发明人 HIRUTA, KENGO
分类号 H05K1/02;H01G13/00;H05K13/00;H05K13/04;(IPC1-7):H05K13/02 主分类号 H05K1/02
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