| 摘要 |
PROBLEM TO BE SOLVED: To bring an integrated circuit to the low cost and miniaturization by containing a semiconductor integrated circuit chip and a piezoelectric material chip in the same package. SOLUTION: A volume contraction material 5 layer is formed on the surfaces of piezoelectric material chips 3, 4, and a semiconductor integrated circuit chip 2 and the piezoelectric material chips 3, 4 are sealed with a sealing material 7, and thereafter the volume of the volume contraction material 5 is reduced, whereby a space is formed on the surface of the piezoelectric material chip. COPYRIGHT: (C)2003,JPO
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