Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion

摘要

Arrangement for producing an electrically conducting connection between electronic components (8) and flexible or rigid conducting plates comprises a laser (2), electron or ion bombardment unit, used to create electrically conducting paths (4, 6). Arrangement for producing an electrically conducting connection between electronic components (8) and flexible or rigid conducting plates comprises a laser (2), electron or ion bombardment unit, used to create electrically conducting paths (4, 6). The electronic components are in the form of discrete elements and integrated members which fit exactly in cut-outs in the rigid or flexible component sections made from non-conducting and optically transparent or non-transparent anti static plastic. The components are welded, soldered or adhered to the conducting plates and the top of the upper conducting plate and the bottom of the lower plate are coated with a non-conducting transparent plastic coating. Negative pressure is created between the components so air is sucked away.