| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a machining apparatus for a wafer having streaks in random directions. <P>SOLUTION: The machining apparatus for a wafer is equipped with a machining tool for machining the surface to be machined of the wafer, comprising a grinding tool or a polishing tool, an oscillation generation body that comprises eccentric weights 41 and 42 and an electromagnet or an ultrasonic vibrator and gives vibration to the machining tool, and a vibration absorber 23, that is interposed between the vibration generation body and an outside frame 20, and cuts off the propagation of the vibration to the outside. <P>COPYRIGHT: (C)2003,JPO</p> |
