HEAT-RESISTANT FLAME-RETARDANT ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD AND FLEXIBLE PRINTED- WIRING BOARD USING IT

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant flame-retardant adhesive composition for a flexible printed-wiring board having high heat resistance while being a non-halogen and having excellent flame retardancy even when a phosphorus content is not increased and the flexible printed-wiring board using the composition. SOLUTION: The heat-resistant flame-retardant adhesive composition for the flexible printed-wiring board using the following (A) and (B) as main components and containing (C) and (D) is prepared. The flexible printed-wiring board is manufactured by using the composition. (A) Polysiloxane imide. (B) An epoxy resin. (C) A compound in which one or more of triazine groups and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxy groups in one molecule respectively. (D) A curing agent. COPYRIGHT: (C)2003,JPO