发明名称 Process for forming thermal conductive sheet
摘要 A thermal conductive sheet with conductive foil is obtained by press bonding a magnetic foil to a thermal conductive layer via a primer layer. Since the primer layer contains a thermal conductive filler, it has high thermal conductivity and does not interrupt thermal conduction from the thermal conductive layer to the magnetic foil. It also spontaneously destroys a skin layer on the surface of the thermal conductive layer upon the press bonding. Accordingly, the thermal conductive sheet with conductive foil of the present invention improves thermal conduction from the thermal conductive layer to the conductive foil, eliminating the unfavorable effects of the skin layer and the primer layer, and thus improves heat radiation of the thermal conductive sheet with conductive foil.
申请公布号 US2003143412(A1) 申请公布日期 2003.07.31
申请号 US20030358425 申请日期 2003.02.04
申请人 YAMAGUCHI AKIO;KAWAI HIDEHARU;KAWAGUCHI YASUHIRO 发明人 YAMAGUCHI AKIO;KAWAI HIDEHARU;KAWAGUCHI YASUHIRO
分类号 B32B15/08;H01L23/36;H01L23/373;H01L23/552;(IPC1-7):B32B27/00 主分类号 B32B15/08
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