发明名称 FLOOR HEAT INSULATING PANEL AND LAYING STRUCTURE OF FLOOR HEAT INSULATING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a new floor heat insulating panel and laying structure of the floor heat insulating panel that can improve airtightness, fix a column onto a sill without forming a cutout at a corner part or an end part and easily realize a barrier-free state, eliminating step difference even in the case a Western-style room and a Japanese-style room adjoin with a doorsill in between. SOLUTION: This floor heat insulating panel comprises a floor board 2 formed in square shape; four frame plates 3-6 with the upper ends fixed to both ends and both sides of the floor board 2; a plurality of partition plates 7-11 fixed in parallel to partition the lower face of the floor board 2 formed of four frame plates 3-6; heat insulating materials 12-17 fitted into spaces formed by the partition plates 7-11 and frame plates 3-6; plastic airtight materials 18 formed at the outer side faces of four frame plates 3-6 and brought into pressure contact with the side face of the sill 21. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003213831(A) 申请公布日期 2003.07.30
申请号 JP20020012680 申请日期 2002.01.22
申请人 HRD SINGAPORE PTE LTD 发明人 HAGIWARA HIROSHI
分类号 E04B1/80;E04B5/02;E04B5/43;E04F15/18;(IPC1-7):E04B5/02 主分类号 E04B1/80
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