| 摘要 |
A pin grid array (PGA) chip package utilises a plurality of flexible spring pins 40. The spring pins, while attached between a printed circuit board (PCB) and a substrate, provide a bent central region that can expand and contract during operational cycles to reduce flaking, cracking and ultimately and electrical open. The spring pins may be bent into a "C" or "V" shape in their middle region before or after attachment to the substrate. Attachment may be by way of brazing, embedding, plating or adhering. |
