| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for shortening an electric signal transmitting time between semiconductor circuit elements, and for disposing the semiconductor circuit elements with high density on a semiconductor wafer. SOLUTION: In this semiconductor device equipped with semiconductor circuit elements formed on a semiconductor wafer and wiring connecting the semiconductor circuit elements, the outer peripheries forming the semiconductor circuit elements and the wiring are formed in parallel with one of vectors mutually crossing at 60°in three directions, the outer peripheries include parts mutually crossing at 120°, the semiconductor wafer is provided with unit cells shaped like equilateral triangles, and the outer peripheries forming the semiconductor elements and the wiring are formed as semiconductor devices in parallel with one of the three sides of the equilateral triangles. COPYRIGHT: (C)2003,JPO
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