发明名称 Wire bonded sensor and method for manufacturing wire bonded sensor
摘要 A sensor includes a first insulating layer, a second insulating layer having an opening, a plurality of metal wirings, and a plurality of electrodes. Each metal wiring has a contacting area. Each metal wiring is located between the first and second insulating layers. Each electrode has a bonding region located separately from the contacting area. The electrodes are in electrical connect with the contacting areas through the openings. A part of each metal wiring is located beneath each bonding region. The electrodes include any of aluminum, two metals of gold and titan, or three metals of gold, nickel, and titan. When the electrodes include aluminum, the electrodes are annealed such that the surface roughness of the electrode is smaller than 100 angstroms. When the electrodes include the two or three metals, the electrodes are annealed in an atmosphere that a partial pressure of oxygen is lower than 10-1 Pa.
申请公布号 US6595050(B2) 申请公布日期 2003.07.22
申请号 US20020196275 申请日期 2002.07.17
申请人 DENSO CORPORATION 发明人 KANO KAZUHIKO;TAKEUCHI YUKIHIRO
分类号 G01F1/684;G01F1/692;H01L21/3205;H01L23/52;(IPC1-7):G01F1/68 主分类号 G01F1/684
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