SEMICONDUCTOR CHIP AND WIRING BASE BOARD AND MANUFACTURING METHOD OF THEM, SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, CIRCUIT BASE BOARD AND ELECTRONIC INSTRUMENT

摘要

PROBLEM TO BE SOLVED: To form a bump capable of preventing the infiltration of moisture into a primary coat for a semiconductor chip and a wiring base board, and to provide the manufacturing method of them, a semiconductor wafer, a semiconductor device, a circuit base board and an electronic instrument.

SOLUTION: A plurality of pads 12 are electrically connected to an integrated circuit. A passivation film 14 covers a part of the pads 12 and exposes the other part of them. A bump 30 is formed in the pad 12. The bump 30 is a single layer, disposed on the part of the pad 12, which is exposed extending from the passivation film 14 to the passivation film 14.

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