发明名称 VARNISH FOR LAMINATE OR PREPREG, LAMINATE OR PREPREG OBTAINED WITH THIS VARNISH, AND PRINTED CIRCUIT BOARD MADE WITH THIS LAMINATE OR PREPREG
摘要 <p>Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70 DEG C to less than 140 DEG C so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.</p>
申请公布号 KR20030061445(A) 申请公布日期 2003.07.18
申请号 KR20037007965 申请日期 2003.06.13
申请人 发明人
分类号 C08G59/04;B32B15/08;C08G59/40;C08G59/68;H05K1/03 主分类号 C08G59/04
代理机构 代理人
主权项
地址