| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a request for a simple and highly productive solder ball method is high among various kinds of methods for forming a solder bump on an electrode, a method of ball arrangement is technically difficult, it takes much time for preparing a tool and it is difficult to cope with a superfine pattern since producing special tools is essential for each electrode pattern in the conventional main-stream arrangement method in a solder ball method, and a superfine pattern cannot be coped with by a solder paste method and variation in a solder thickness is large. SOLUTION: In the method, a porous plate and a mask are used for independently using each of reduced pressure and vibration or using the reduced pressure and vibration at the same time, thus collecting balls to a mask recess. In the method, alignment and transfer efficiently are extremely appropriate, and at the same time even a superfine pattern can be easily coped with. At the same time, it is found that a mask can be prepared in a short time, and work can be started. COPYRIGHT: (C)2003,JPO
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