发明名称 |
Cover tape for packaging electronic elements |
摘要 |
A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60 DEG C, and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60 DEG C, and an electroconductive fine powder dispersed in said resin. <IMAGE>
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申请公布号 |
EP1328018(A1) |
申请公布日期 |
2003.07.16 |
申请号 |
EP20030000018 |
申请日期 |
2003.01.02 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
MARUMO, TSUYOSHI;NAKANISHI, HISAO |
分类号 |
B65D85/86;B32B27/08;B32B27/18;B32B27/30;B65D65/40;H01L21/00;H01L21/68;(IPC1-7):H01L23/02;H01L23/10;B32B27/36 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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